Embedded Thermal Control for Subsystems for Next Generation Spacecraft Applications

Source-supplied abstract

Thermal Fluids and Analysis Workshop, Silver Spring MD NCTS 21070-15. NASA, the Defense Department and commercial interests are actively engaged in developing miniaturized spacecraft systems and scientific instruments to leverage smaller cheaper spacecraft form factors such as CubeSats. This paper outlines research and development efforts among Goddard Space Flight Center personnel and its several partners to develop innovative embedded thermal control subsystems. Embedded thermal control subsystems is a cross cutting enabling technology integrating advanced manufacturing techniques to develop multifunctional intelligent structures to reduce Size, Weight and Power (SWaP) consumption of both the thermal control subsystem and overall spacecraft. Embedded thermal control subsystems permit heat acquisition and rejection at higher temperatures than state of the art systems by employing both advanced heat transfer equipment (integrated heat exchangers) and high heat transfer phenomena. The Goddard Space Flight Center Thermal Engineering Branch has active investigations seeking to characterize advanced thermal control systems for near term spacecraft missions. The embedded thermal control subsystem development effort consists of fundamental research as well as development of breadboard and prototype hardware and spaceflight validation efforts. This paper will outline relevant fundamental investigations of micro-scale heat transfer and electrically driven liquid film boiling. The hardware development efforts focus upon silicon based high heat flux applications (electronic chips, power electronics etc.) and multifunctional structures. Flight validation efforts include variable gravity campaigns and a proposed CubeSat based flight demonstration of a breadboard embedded thermal control system. The CubeSat investigation is technology demonstration will characterize in long-term low earth orbit a breadboard embedded thermal subsystem and its individual components to develop optimized operational schema.

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